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Etchant for printed circuit boards and copper. Ideal alternative to iron chloride. The agent dissolves very quickly and does not crystallize from the solution. It etches evenly, ensuring sharp contours and minimizing underetching. Method of use: Dissolve the preparation in 0.5 l of water at 50°C. Etch at a temperature of 40°C (max. 50°C). The movement of the bath ensures faster etching. The etching solution must not be stored in hermetically sealed containers due to the danger of pressure buildup and bursting. Specification: Manufacturer: AG TermoPasty Packing: 250g
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