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THERMAL CONDUCTIVE PASTE HPX 100G SILICONE AG THERMAL PASTES
The HPX thermal conductive paste with a thermal conductivity coefficient >2.8W/mK, which does not conduct electric current. It is essential for the proper functioning of all types of temperature sensors. The low thermal impedance of the paste enables consistent effectiveness at temperatures from -50 to 250 C.
Application:
- Modules with high thermal conductivity,
- Cooling devices on end plates and frames,
- Mass storage and high-speed drives,
- Motor control circuits (automotive industry),
- Hard drives and DVD drives,
- Power converters,
- High-power LEDs,
- Laptops and office computers,
- Network communication devices,
- Household appliances, electronic and electrical components,
- Air conditioners.
Physico-chemical properties:
- Color: gray
- Thermal conductivity: W/mK > 2.8
- Thermal impedance: C in2/W < 0.095
- Specific weight: g/cm > 2.15
- Evaporation: 0.001
- Leakage: 0.05
- Dielectric constant: 5.1
- Viscosity: does not flow
- Thixotropic index: 380+/-10
- Temperature resistance: -50C ~ 300C
- Operating temperature: -50C ~ 250C
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