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Paste designed for soldering SMD components in production processes not involving washing phases. Based on a No Clean type flux that does not require washing, its residues do not cause corrosion spots. The product works with all lead-free alloys, characterized by good adhesion and wetting of the soldered surface. It does not lose its physicochemical properties even after 20 hours left on the PCB. This time depends on the conditions prevailing in the room: humidity and temperature.
Contains a rosin-based flux. The presence of an activator prevents the formation of air bubbles in the soldered joints. These joints have very good mechanical and electrical properties. If the process includes a washing phase, this can be done with commonly available means (water PCB cleaner, alcohol PCB cleaner).
Specification:
Manufacturer: AG TermoPasty Packaging: Syringe 1.4 ml
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