Easy Print Sn96 5Ag3CU0 5 1 4ml AG

Easy Print Sn96 5Ag3CU0 5 1 4ml AG - description

Easy Print solder paste Sn96,5Ag3Cu0,5, AG39 Easy Print Sn96.5Ag3Cu0.5 from AG Termopasty is a paste designed for soldering SMD elements in production processes that do not take into account washing phases. Based on No Clean flux, which does not require washing, the remains of which do not cause corrosion centers. The product works with all lead-free alloys, is characterized by good adhesion and wettability of the soldered surface. It does not lose its physicochemical properties even after 20 hours of leaving it on the PCB. Product features: Binder type: Sn96,5/Ag3/Cu0,5 Density: 4.6 g/cm³ Printability over 8h Does not contain chlorides Flux residue does not corrode, does not require washing Soldered joints have good mechanical and electrical properties Resistant to mid-chip solderballing, Good adhesion to elements for more than 24 hours after its application, The paste faithfully reproduces contours for up to 8 hours of continuous printing, which ensures its extended shelf life (stencil life), Minimal, colorless, non-corrosive residues after soldering (no clean), which thanks to their flexibility facilitate the penetration of testers' needles, The paste has high fidelity of detail reproduction (fine pitch), Printing possibilities with a speed of squeegee up to 150 mm / s

---

Payment options

• Bank transfer
• Cash
• Payment online
• PayPal
• VISA
• MasterCard
• Maestro

---

Delivery options

• Collection in person
• National delivery
• International delivery